EP3SE260H780C3 vs EP3SE260H780C2N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C3 sa pamamagitan ng Intel at EP3SE260H780C2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260H780C3 EP3SE260H780C2N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Huling Pagbili
Device Family Stratix III Enhanced (Stratix III E) —
Series EP3SE Stratix III E
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10200 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
User I/Os 488 —
Operating Voltage (Core) 0.9 V —
Operating Voltage (Auxiliary) 1.1 V —
Process Technology 65 nm CMOS —
Speed Grade C3 C2
Temperature na Operasyon Commercial, 0C to +85C —
Maximum Core Frequency 500 MHz —
Packhaging 780-ball FCBGA (HBGA), flip-chip 780-BGA FCBGA
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 hours) —
Packaging Type Tray —
Configuration Memory Support Fast passive parallel, JTAG, Active Serial —
Tindminan RoHS Compliant (per product listings) [DATA_NEEDED: rohs status]
LABs / CLBs — 10,200
Total RAM Bits — 16,672,768
User I/O Count — 488
Number of Transceivers — [DATA_NEEDED: transceiver count]
Core Voltage — 0.9 V
Hanay ng Temperature na Operasyon — Commercial (0C to +85C)
Level ng MSL — 3 (168 hours)
Reflow Peak Time Max — 40 s
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780
Process Node — 40 nm

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