EP3SE260H780I4L vs EP3SL50F780I4L Perbandingan
Perbandingan bersamaan detil EP3SE260H780I4L dari Intel dan EP3SL50F780I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260H780I4L | EP3SL50F780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Family | Stratix III E (Enhanced) | Stratix III L |
| Logic Elements | 255,000 | 47,500 |
| Total Memory Bits | 16,672,640 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 488 | 488 |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 65 nm | 65 nm CMOS |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) | — |
| Tipe Mounting | Surface Mount (flip-chip) | Surface Mount (BGA) |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) | — |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) | — |
| Number of 18x18 Multipliers | [DATA_NEEDED: per-package multiplier count] | — |
| Suhu Kerja | Industrial, -40C to +85C | -40C to +100C (Industrial) |
| Status RoHS | Compliant (lead-free) | — |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) | — |
| Embedded Memory (bits) | — | 2,184,192 |
| I/O Banks | — | 8 |
| Paket | — | 780-BBGA, FCBGA (29 mm) |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Speed Grade | — | I4 |
| Level MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Configuration Memory | — | SRAM-based, volatile |
| Design Suite | — | Quartus II / Quartus Prime (Stratix III support) |
| Device Sub-Family | — | Low-Power (L) |
| Country of Origin | — | [DATA_NEEDED: COO not specified in source data] |