EP3SE260H780I4L vs EP3SL50F780I4L Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260H780I4L disebabkan oleh Intel dan EP3SL50F780I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE260H780I4L EP3SL50F780I4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Aktif
Family Stratix III E (Enhanced) Stratix III L
Logic Elements 255,000 47,500
Total Memory Bits 16,672,640 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 488
Core Voltage 0.9 V 0.9 V
Process Technology 65 nm 65 nm CMOS
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
Jenis Pemasangan Surface Mount (flip-chip) Surface Mount (BGA)
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
Suhu Operasi Industrial, -40C to +85C -40C to +100C (Industrial)
Status RoHS Compliant (lead-free) —
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel —
Pin/Package 780-BBGA, FCBGA (flip-chip) —
Embedded Memory (bits) — 2,184,192
I/O Banks — 8
Kemasan — 780-BBGA, FCBGA (29 mm)
Lead-Free / RoHS — Yes (L suffix)
Speed Grade — I4
Aras MSL — [DATA_NEEDED: MSL moisture sensitivity level]
Configuration Memory — SRAM-based, volatile
Design Suite — Quartus II / Quartus Prime (Stratix III support)
Device Sub-Family — Low-Power (L)
Country of Origin — [DATA_NEEDED: COO not specified in source data]

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