EP3SE260H780I4L vs EP3SL50F780I4L 比較
詳細並排比較 EP3SE260H780I4L 由 Intel 與 EP3SL50F780I4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780I4L | EP3SL50F780I4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Family | Stratix III E (Enhanced) | Stratix III L |
| Logic Elements | 255,000 | 47,500 |
| Total Memory Bits | 16,672,640 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 488 | 488 |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 65 nm | 65 nm CMOS |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) | — |
| 安裝類型 | Surface Mount (flip-chip) | Surface Mount (BGA) |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) | — |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) | — |
| Number of 18x18 Multipliers | [DATA_NEEDED: per-package multiplier count] | — |
| 工作溫度 | Industrial, -40C to +85C | -40C to +100C (Industrial) |
| RoHS 狀態 | Compliant (lead-free) | — |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) | — |
| Embedded Memory (bits) | — | 2,184,192 |
| I/O Banks | — | 8 |
| 封裝 | — | 780-BBGA, FCBGA (29 mm) |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Speed Grade | — | I4 |
| MSL 等級 | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Configuration Memory | — | SRAM-based, volatile |
| Design Suite | — | Quartus II / Quartus Prime (Stratix III support) |
| Device Sub-Family | — | Low-Power (L) |
| Country of Origin | — | [DATA_NEEDED: COO not specified in source data] |