EP3SE260H780I4L vs EP3SL50F780I4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4L sa pamamagitan ng Intel at EP3SL50F780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780I4L EP3SL50F780I4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Aktibo
Family Stratix III E (Enhanced) Stratix III L
Logic Elements 255,000 47,500
Total Memory Bits 16,672,640 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 488
Core Voltage 0.9 V 0.9 V
Process Technology 65 nm 65 nm CMOS
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
Uri ng Pagpapasok Surface Mount (flip-chip) Surface Mount (BGA)
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
Temperature na Operasyon Industrial, -40C to +85C -40C to +100C (Industrial)
Tindminan RoHS Compliant (lead-free) —
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel —
Pin/Package 780-BBGA, FCBGA (flip-chip) —
Embedded Memory (bits) — 2,184,192
I/O Banks — 8
Packhaging — 780-BBGA, FCBGA (29 mm)
Lead-Free / RoHS — Yes (L suffix)
Speed Grade — I4
Level ng MSL — [DATA_NEEDED: MSL moisture sensitivity level]
Configuration Memory — SRAM-based, volatile
Design Suite — Quartus II / Quartus Prime (Stratix III support)
Device Sub-Family — Low-Power (L)
Country of Origin — [DATA_NEEDED: COO not specified in source data]

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