EP3SL200H780I4LN vs EP3SL200H780C4L Perbandingan
Perbandingan bersamaan detil EP3SL200H780I4LN dari Altera dan EP3SL200H780C4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780I4LN | EP3SL200H780C4L |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Stratix III L | Stratix III |
| Family | Stratix III L (Low-Power) | — |
| Manufacturer | Intel / Altera (now Intel PSG) | Intel (formerly Altera) |
| Number of Logic Elements / Cells | 200,000 | — |
| Number of LABs / CLBs | 8,000 | — |
| Total RAM Bits | 10,901,504 (approximately 10.9 Mbit) | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 0.9 V core (selectable Vcore) | — |
| Suhu Kerja | -40C to +100C (industrial) | 0C to 85C (commercial) |
| Tipe Mounting | Surface Mount | — |
| Paket / Case | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Speed Grade | I4 (Industrial, mid-speed grade) | -4 (medium performance, commercial) |
| Status RoHS | RoHS Compliant (lead-free) | Compliant |
| Level MSL | MSL 3 (168 Hours, per JEDEC J-STD-020) | — |
| Roaming Pin Name Suffix | LN = lead-free, industrial temp, H780 780-ball package | — |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Elements | — | 200,000 |
| Embedded Memory | — | 6.5 Mbit |
| User I/O Count | — | 488 |
| Package Type | — | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Code | — | BGA-780 / PBGA780 / HBGA-780 |
| Package Mounting | — | Surface Mount |
| Internal Logic Frequency | — | up to 717 MHz (per ampheo datasheet brief) |
| Lead-Free / Pb-Free | — | Yes (L suffix, lead-free) |
| Configuration Modes | — | FPP, AS, PS, JTAG |