EP3SL200H780I4LN vs EP3SL200H780C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I4LN sa pamamagitan ng Altera at EP3SL200H780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780I4LN | EP3SL200H780C4L |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Stratix III L | Stratix III |
| Family | Stratix III L (Low-Power) | — |
| Manufacturer | Intel / Altera (now Intel PSG) | Intel (formerly Altera) |
| Number of Logic Elements / Cells | 200,000 | — |
| Number of LABs / CLBs | 8,000 | — |
| Total RAM Bits | 10,901,504 (approximately 10.9 Mbit) | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 0.9 V core (selectable Vcore) | — |
| Temperature na Operasyon | -40C to +100C (industrial) | 0C to 85C (commercial) |
| Uri ng Pagpapasok | Surface Mount | — |
| Packhaging / Kaso | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Speed Grade | I4 (Industrial, mid-speed grade) | -4 (medium performance, commercial) |
| Tindminan RoHS | RoHS Compliant (lead-free) | Compliant |
| Level ng MSL | MSL 3 (168 Hours, per JEDEC J-STD-020) | — |
| Roaming Pin Name Suffix | LN = lead-free, industrial temp, H780 780-ball package | — |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Elements | — | 200,000 |
| Embedded Memory | — | 6.5 Mbit |
| User I/O Count | — | 488 |
| Package Type | — | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Code | — | BGA-780 / PBGA780 / HBGA-780 |
| Package Mounting | — | Surface Mount |
| Internal Logic Frequency | — | up to 717 MHz (per ampheo datasheet brief) |
| Lead-Free / Pb-Free | — | Yes (L suffix, lead-free) |
| Configuration Modes | — | FPP, AS, PS, JTAG |