EP3SL200H780I4LN vs EP3SL200H780C4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL200H780I4LN disebabkan oleh Altera dan EP3SL200H780C4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL200H780I4LN | EP3SL200H780C4L |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Series | Stratix III L | Stratix III |
| Family | Stratix III L (Low-Power) | — |
| Manufacturer | Intel / Altera (now Intel PSG) | Intel (formerly Altera) |
| Number of Logic Elements / Cells | 200,000 | — |
| Number of LABs / CLBs | 8,000 | — |
| Total RAM Bits | 10,901,504 (approximately 10.9 Mbit) | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 0.9 V core (selectable Vcore) | — |
| Suhu Operasi | -40C to +100C (industrial) | 0C to 85C (commercial) |
| Jenis Pemasangan | Surface Mount | — |
| Kemasan / Case | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Speed Grade | I4 (Industrial, mid-speed grade) | -4 (medium performance, commercial) |
| Status RoHS | RoHS Compliant (lead-free) | Compliant |
| Aras MSL | MSL 3 (168 Hours, per JEDEC J-STD-020) | — |
| Roaming Pin Name Suffix | LN = lead-free, industrial temp, H780 780-ball package | — |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Elements | — | 200,000 |
| Embedded Memory | — | 6.5 Mbit |
| User I/O Count | — | 488 |
| Package Type | — | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Code | — | BGA-780 / PBGA780 / HBGA-780 |
| Package Mounting | — | Surface Mount |
| Internal Logic Frequency | — | up to 717 MHz (per ampheo datasheet brief) |
| Lead-Free / Pb-Free | — | Yes (L suffix, lead-free) |
| Configuration Modes | — | FPP, AS, PS, JTAG |