EP3SL50F484I3 vs EP3SE50F484I3 Perbandingan
Perbandingan bersamaan detil EP3SL50F484I3 dari Intel dan EP3SE50F484I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL50F484I3 | EP3SE50F484I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L (Low Power) | Stratix III E |
| Device Logic Elements | 47,500 | — |
| Embedded Memory (bits) | 2,184,192 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Maximum User I/O | 296 | — |
| Paket | 484-ball FC-FBGA (Flip-Chip FineLine BGA) | 484-ball FCBGA (FineLine BGA), 1.0 mm pitch |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Internal Operating Frequency | 500 MHz | — |
| Suhu Kerja | 0 °C to +85 °C (commercial) | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | [DATA_NEEDED: lead-free/RoHS status] | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Configuration Scheme | SRAM-based (volatile, requires external config device) | — |
| Transceivers | Stratix III L — supports high-speed serial transceivers per family datasheet | Multi-gigabit transceivers supported |
| Logic Elements | — | 47,500 |
| Embedded Memory | — | 5,760 Kbits |
| User I/Os | — | 296 |
| Operating Temperature Grade | — | Industrial (-40 °C to +100 °C) |
| Speed Grade | — | I3 (-3 speed bin, industrial) |
| DSP Blocks | — | Yes (embedded multipliers and accumulators) |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| PLLs | — | Yes (multiple, for clock management) |
| I/O Standards | — | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |