EP3SL50F484I3 vs EP3SE50F484I3 比較

詳細並排比較 EP3SL50F484I3 由 Intel 與 EP3SE50F484I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SL50F484I3 EP3SE50F484I3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III L (Low Power) Stratix III E
Device Logic Elements 47,500 —
Embedded Memory (bits) 2,184,192 —
Logic Array Blocks (LABs) 1,900 1,900
Maximum User I/O 296 —
封裝 484-ball FC-FBGA (Flip-Chip FineLine BGA) 484-ball FCBGA (FineLine BGA), 1.0 mm pitch
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
Internal Operating Frequency 500 MHz —
工作溫度 0 °C to +85 °C (commercial) —
安裝類型 Surface Mount Surface Mount (BGA)
Lead-Free / RoHS [DATA_NEEDED: lead-free/RoHS status] —
MSL 等級 [DATA_NEEDED: MSL level] —
Configuration Scheme SRAM-based (volatile, requires external config device) —
Transceivers Stratix III L — supports high-speed serial transceivers per family datasheet Multi-gigabit transceivers supported
Logic Elements — 47,500
Embedded Memory — 5,760 Kbits
User I/Os — 296
Operating Temperature Grade — Industrial (-40 °C to +100 °C)
Speed Grade — I3 (-3 speed bin, industrial)
DSP Blocks — Yes (embedded multipliers and accumulators)
Configuration Modes — AS, PS, FPP, JTAG
PLLs — Yes (multiple, for clock management)
I/O Standards — LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X
RoHS 狀態 — Compliant
Lead-Free — Yes

資料表與資源

瀏覽所有產品 建立 BOM 索取報價