EP3SL50F780C3 vs EP3SL70F780C3 Perbandingan

Perbandingan bersamaan detil EP3SL50F780C3 dari Intel dan EP3SL70F780C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL50F780C3 EP3SL70F780C3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir NRND
Family Stratix III L (low-power) Stratix III
Series Stratix III Stratix III L
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 2,700
Embedded Memory Bits 2,184,192 —
User I/Os 488 —
Package Type 780-BBGA, FCBGA (FineLine) —
Device Pin Count 780 —
Suhu Kerja 0C to +85C (Commercial) —
Speed Grade 3 C3
Supply Voltage (Core) [DATA_NEEDED: VCCINT nominal value] —
PLLs 12 —
Global Clock Networks 24 —
Process Node 65 nm TSMC —
Configuration Method SRAM-based, supports Partial Reconfiguration —
Status RoHS Compliant [DATA_NEEDED: RoHS status]
Lead-Free / Halogen-Free Lead-Free (per package marking); Halogen-Free status unknown —
Tingkat Sensitivitas Kekeringan (MSL) MSL3 (per JEDEC J-STD-020, typical for large FBGA) —
Logic Elements (LE) — 67,500
Embedded Memory (bits) — 2,699,264
User I/O Count — 488
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Number of Pins / Balls — 780
Paket — 780-BBGA, FC-FBGA
Tipe Mounting — Surface Mount
Process Technology — 65 nm
Core Voltage (VCCINT) — 1.1 V
Maximum Internal Clock Frequency — 500 MHz
Rentang Suhu Kerja — 0°C to 85°C (commercial)
Design Software — Quartus II (last supported v13.1)

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