EP3SL50F780C3 vs EP3SL70F780C3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780C3 disebabkan oleh Intel dan EP3SL70F780C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL50F780C3 EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera

EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera

EP3SL50F780C3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL50F780C3 EP3SL70F780C3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Family Stratix III L (low-power) Stratix III
Series Stratix III Stratix III L
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 2,700
Embedded Memory Bits 2,184,192 —
User I/Os 488 —
Package Type 780-BBGA, FCBGA (FineLine) —
Device Pin Count 780 —
Suhu Operasi 0C to +85C (Commercial) —
Speed Grade 3 C3
Supply Voltage (Core) [DATA_NEEDED: VCCINT nominal value] —
PLLs 12 —
Global Clock Networks 24 —
Process Node 65 nm TSMC —
Configuration Method SRAM-based, supports Partial Reconfiguration —
Status RoHS Compliant [DATA_NEEDED: RoHS status]
Lead-Free / Halogen-Free Lead-Free (per package marking); Halogen-Free status unknown —
Tingkat sensitiviti Air Nama (MSL) MSL3 (per JEDEC J-STD-020, typical for large FBGA) —
Logic Elements (LE) — 67,500
Embedded Memory (bits) — 2,699,264
User I/O Count — 488
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Number of Pins / Balls — 780
Kemasan — 780-BBGA, FC-FBGA
Jenis Pemasangan — Surface Mount
Process Technology — 65 nm
Core Voltage (VCCINT) — 1.1 V
Maximum Internal Clock Frequency — 500 MHz
Gambaran Suhu Operasi — 0°C to 85°C (commercial)
Design Software — Quartus II (last supported v13.1)

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