EP3SL70F780I3 vs EP3SL70F780I3G Perbandingan

Perbandingan bersamaan detil EP3SL70F780I3 dari Intel dan EP3SL70F780I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SL70F780I3 EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel

EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel

EP3SL70F780I3 ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SL70F780I3 EP3SL70F780I3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir NRND
Family Stratix III L Stratix III L
Logic Elements 67,500 —
Embedded Memory Bits 2,699,264 bits —
Maximum User I/O 488 —
Suhu Kerja -40 C to +100 C (Industrial) -40C to +100C (Industrial)
Speed Grade I3 (industrial) 3 (Medium)
Core Voltage 1.1 V —
Process Node 65 nm —
Paket 780-ball FineLine BGA (FC-FBGA), 28x28 mm 780-BBGA, FCBGA (29x29 mm)
Package Code BGA780,28X28,40 —
Tipe Mounting Surface Mount Surface Mount
Configuration Mode JTAG IEEE 1149.1, Passive Serial, Active Serial —
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Number of Terminals 780 —
Supplier Device Package 780-BBGA, FCBGA —
Logic Elements (LE) — 67,500
Adaptive Logic Modules (ALM) — 27,000 ALM
Embedded Memory — 2,699,264 bits (2.57 Mbit)
User I/Os — 488
Core Voltage (VCCINT) — 1.1 V
Process Technology — 40 nm TSMC
Tipe Memori — SRAM-based, external configuration
DSP Blocks — Multipliers, count varies by die
Configuration — External (EPCS / JTAG)
Packaging — Tray

Spek dan Sumber

Buka Semua Produk Buat BOM Ajukan Diskon