EP3SL70F780I3 vs EP3SL70F780I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I3 sa pamamagitan ng Intel at EP3SL70F780I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780I3 | EP3SL70F780I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | — |
| Embedded Memory Bits | 2,699,264 bits | — |
| Maximum User I/O | 488 | — |
| Temperature na Operasyon | -40 C to +100 C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I3 (industrial) | 3 (Medium) |
| Core Voltage | 1.1 V | — |
| Process Node | 65 nm | — |
| Packhaging | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | 780-BBGA, FCBGA (29x29 mm) |
| Package Code | BGA780,28X28,40 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Number of Terminals | 780 | — |
| Supplier Device Package | 780-BBGA, FCBGA | — |
| Logic Elements (LE) | — | 67,500 |
| Adaptive Logic Modules (ALM) | — | 27,000 ALM |
| Embedded Memory | — | 2,699,264 bits (2.57 Mbit) |
| User I/Os | — | 488 |
| Core Voltage (VCCINT) | — | 1.1 V |
| Process Technology | — | 40 nm TSMC |
| Uri ng Memory | — | SRAM-based, external configuration |
| DSP Blocks | — | Multipliers, count varies by die |
| Configuration | — | External (EPCS / JTAG) |
| Packaging | — | Tray |