EP3SL70F780I3 vs EP3SL70F780I3G 比較

詳細並排比較 EP3SL70F780I3 由 Intel 與 EP3SL70F780I3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SL70F780I3 EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel

EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel

EP3SL70F780I3 ⚠ 最後購買機會

規格比較

參數 EP3SL70F780I3 EP3SL70F780I3G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 NRND
Family Stratix III L Stratix III L
Logic Elements 67,500 —
Embedded Memory Bits 2,699,264 bits —
Maximum User I/O 488 —
工作溫度 -40 C to +100 C (Industrial) -40C to +100C (Industrial)
Speed Grade I3 (industrial) 3 (Medium)
Core Voltage 1.1 V —
Process Node 65 nm —
封裝 780-ball FineLine BGA (FC-FBGA), 28x28 mm 780-BBGA, FCBGA (29x29 mm)
Package Code BGA780,28X28,40 —
安裝類型 Surface Mount Surface Mount
Configuration Mode JTAG IEEE 1149.1, Passive Serial, Active Serial —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant
Number of Terminals 780 —
Supplier Device Package 780-BBGA, FCBGA —
Logic Elements (LE) — 67,500
Adaptive Logic Modules (ALM) — 27,000 ALM
Embedded Memory — 2,699,264 bits (2.57 Mbit)
User I/Os — 488
Core Voltage (VCCINT) — 1.1 V
Process Technology — 40 nm TSMC
記憶體類型 — SRAM-based, external configuration
DSP Blocks — Multipliers, count varies by die
Configuration — External (EPCS / JTAG)
Packaging — Tray

資料表與資源

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