EP3SL70F780I3 vs EP3SL70F780I3N Perbandingan
Perbandingan bersamaan detil EP3SL70F780I3 dari Intel dan EP3SL70F780I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP3SL70F780I3 | EP3SL70F780I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory Bits | 2,699,264 bits | — |
| Maximum User I/O | 488 | — |
| Suhu Kerja | -40 C to +100 C (Industrial) | — |
| Speed Grade | I3 (industrial) | I3 (industrial) |
| Core Voltage | 1.1 V | 1.1 V (1.05 V to 1.15 V) |
| Process Node | 65 nm | — |
| Paket | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | — |
| Package Code | BGA780,28X28,40 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (per distributor listings) |
| Number of Terminals | 780 | — |
| Supplier Device Package | 780-BBGA, FCBGA | — |
| Logic Array Blocks (LABs) | — | 2,700 |
| Embedded Memory (bits) | — | 2,699,264 |
| User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Operating Frequency | — | 500 MHz |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) |
| Ball Pitch | — | 1.0 mm |
| Suhu Hubung Kerja | — | -40 C to +100 C |
| Configuration | — | SRAM-based, volatile |