EP3SL70F780I3 vs EP3SL70F780I3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780I3 disebabkan oleh Intel dan EP3SL70F780I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
EP3SL70F780I3 ⚠ Bahagian terakhir untuk beli
Pengandingan Spesifikasi
| Parametr | EP3SL70F780I3 | EP3SL70F780I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory Bits | 2,699,264 bits | — |
| Maximum User I/O | 488 | — |
| Suhu Operasi | -40 C to +100 C (Industrial) | — |
| Speed Grade | I3 (industrial) | I3 (industrial) |
| Core Voltage | 1.1 V | 1.1 V (1.05 V to 1.15 V) |
| Process Node | 65 nm | — |
| Kemasan | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | — |
| Package Code | BGA780,28X28,40 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (per distributor listings) |
| Number of Terminals | 780 | — |
| Supplier Device Package | 780-BBGA, FCBGA | — |
| Logic Array Blocks (LABs) | — | 2,700 |
| Embedded Memory (bits) | — | 2,699,264 |
| User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Operating Frequency | — | 500 MHz |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) |
| Ball Pitch | — | 1.0 mm |
| Suhu Hubungan Operasi | — | -40 C to +100 C |
| Configuration | — | SRAM-based, volatile |