EP3SL70F780I3 vs EP3SL70F780I3N 比較
詳細並排比較 EP3SL70F780I3 由 Intel 與 EP3SL70F780I3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SL70F780I3 | EP3SL70F780I3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Embedded Memory Bits | 2,699,264 bits | — |
| Maximum User I/O | 488 | — |
| 工作溫度 | -40 C to +100 C (Industrial) | — |
| Speed Grade | I3 (industrial) | I3 (industrial) |
| Core Voltage | 1.1 V | 1.1 V (1.05 V to 1.15 V) |
| Process Node | 65 nm | — |
| 封裝 | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | — |
| Package Code | BGA780,28X28,40 | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant (per distributor listings) |
| Number of Terminals | 780 | — |
| Supplier Device Package | 780-BBGA, FCBGA | — |
| Logic Array Blocks (LABs) | — | 2,700 |
| Embedded Memory (bits) | — | 2,699,264 |
| User I/Os | — | 488 |
| Process Technology | — | 65 nm CMOS |
| Operating Frequency | — | 500 MHz |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) |
| Ball Pitch | — | 1.0 mm |
| 工作接面溫度 | — | -40 C to +100 C |
| Configuration | — | SRAM-based, volatile |