EP4CGX75CF23I8N vs EP4CGX110CF23I7N Perbandingan
Perbandingan bersamaan detil EP4CGX75CF23I8N dari Intel dan EP4CGX110CF23I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX75CF23I8N | EP4CGX110CF23I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Embedded Memory Bits | 4,257,792 | — |
| Embedded Memory Type | M9K blocks | — |
| Embedded Multipliers (18x18) | 198 | — |
| Maximum User I/O Pins | 290 | — |
| Transceivers | 8 channels up to 3.125 Gbps | — |
| PCIe Hard IP | 1 hard PCIe Gen1 block (x1/x2/x4) | — |
| PLLs | 4 | — |
| DLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Paket | 484-ball FBGA | FBGA-484 (484-pin FineLine BGA) |
| Package Code | F23 | — |
| Speed Grade | 8 (commercial fast) | I7 (industrial, balance of speed and power) |
| Suhu Hubung Kerja | -40C to +100C (industrial) | — |
| Status RoHS | Compliant | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Level MSL | 3 | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements | — | 109,424 |
| Configurable Logic Blocks (CLBs / LABs) | — | 6,839 |
| Embedded Memory | — | 5,621,760 bits |
| User I/O Count | — | 270 |
| Supply Voltage (Core) | — | 1.2 V |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Maximum Operating Frequency | — | 472.5 MHz |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Suhu Kerja | — | -40 °C to +100 °C (industrial, inferred from 'I') |