EP4CGX75CF23I8N vs EP4CGX110CF23I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX75CF23I8N disebabkan oleh Intel dan EP4CGX110CF23I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CGX75CF23I8N | EP4CGX110CF23I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Embedded Memory Bits | 4,257,792 | — |
| Embedded Memory Type | M9K blocks | — |
| Embedded Multipliers (18x18) | 198 | — |
| Maximum User I/O Pins | 290 | — |
| Transceivers | 8 channels up to 3.125 Gbps | — |
| PCIe Hard IP | 1 hard PCIe Gen1 block (x1/x2/x4) | — |
| PLLs | 4 | — |
| DLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Kemasan | 484-ball FBGA | FBGA-484 (484-pin FineLine BGA) |
| Package Code | F23 | — |
| Speed Grade | 8 (commercial fast) | I7 (industrial, balance of speed and power) |
| Suhu Hubungan Operasi | -40C to +100C (industrial) | — |
| Status RoHS | Compliant | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | 3 | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements | — | 109,424 |
| Configurable Logic Blocks (CLBs / LABs) | — | 6,839 |
| Embedded Memory | — | 5,621,760 bits |
| User I/O Count | — | 270 |
| Supply Voltage (Core) | — | 1.2 V |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Maximum Operating Frequency | — | 472.5 MHz |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Suhu Operasi | — | -40 °C to +100 °C (industrial, inferred from 'I') |