EP4CGX75CF23I8N vs EP4CGX110CF23I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX75CF23I8N sa pamamagitan ng Intel at EP4CGX110CF23I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX75CF23I8N | EP4CGX110CF23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Embedded Memory Bits | 4,257,792 | — |
| Embedded Memory Type | M9K blocks | — |
| Embedded Multipliers (18x18) | 198 | — |
| Maximum User I/O Pins | 290 | — |
| Transceivers | 8 channels up to 3.125 Gbps | — |
| PCIe Hard IP | 1 hard PCIe Gen1 block (x1/x2/x4) | — |
| PLLs | 4 | — |
| DLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Packhaging | 484-ball FBGA | FBGA-484 (484-pin FineLine BGA) |
| Package Code | F23 | — |
| Speed Grade | 8 (commercial fast) | I7 (industrial, balance of speed and power) |
| Temperature ng Junction na Operasyon | -40C to +100C (industrial) | — |
| Tindminan RoHS | Compliant | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Level ng MSL | 3 | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Logic Elements | — | 109,424 |
| Configurable Logic Blocks (CLBs / LABs) | — | 6,839 |
| Embedded Memory | — | 5,621,760 bits |
| User I/O Count | — | 270 |
| Supply Voltage (Core) | — | 1.2 V |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Maximum Operating Frequency | — | 472.5 MHz |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Temperature na Operasyon | — | -40 °C to +100 °C (industrial, inferred from 'I') |