EP4SGX110DF29C3G vs EP4SGX70DF29C4G Perbandingan
Perbandingan bersamaan detil EP4SGX110DF29C3G dari Intel dan EP4SGX70DF29C4G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX110DF29C3G | EP4SGX70DF29C4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV |
| Logic Elements | 105,600 | — |
| Adaptive Logic Modules (ALMs) | 4,224 LABs | — |
| Total Memory Bits | 9,793,536 | 7,564,880 |
| User I/O Count | 372 | 372 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | 780-BBGA, FCBGA |
| Package Pin/Ball Count | 780 | — |
| Tegangan Pemuat | 0.9 V core | — |
| Process Technology | 40 nm | — |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Transceiver Count | [DATA_NEEDED: number of transceivers] | — |
| DSP Blocks | 266 (18x18 multipliers) | — |
| Suhu Kerja | Commercial (0C to +85C) - per C3 grade suffix | [DATA_NEEDED: Operating Temperature Range] |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Tipe Mounting | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Logic Elements (LE) | — | 72,600 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| Package Code | — | BGA |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Process Node | — | 40 nm |
| Speed Grade | — | C4 (commercial) |