EP4SGX110DF29C3G vs EP4SGX70DF29C4G 比較
詳細並排比較 EP4SGX110DF29C3G 由 Intel 與 EP4SGX70DF29C4G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4SGX110DF29C3G | EP4SGX70DF29C4G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV |
| Logic Elements | 105,600 | — |
| Adaptive Logic Modules (ALMs) | 4,224 LABs | — |
| Total Memory Bits | 9,793,536 | 7,564,880 |
| User I/O Count | 372 | 372 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | 780-BBGA, FCBGA |
| Package Pin/Ball Count | 780 | — |
| 供應電壓 | 0.9 V core | — |
| Process Technology | 40 nm | — |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Transceiver Count | [DATA_NEEDED: number of transceivers] | — |
| DSP Blocks | 266 (18x18 multipliers) | — |
| 工作溫度 | Commercial (0C to +85C) - per C3 grade suffix | [DATA_NEEDED: Operating Temperature Range] |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance status] | Compliant |
| 安裝類型 | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Logic Elements (LE) | — | 72,600 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| Package Code | — | BGA |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Process Node | — | 40 nm |
| Speed Grade | — | C4 (commercial) |