EP4SGX110DF29C3G vs EP4SGX70DF29C4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX110DF29C3G sa pamamagitan ng Intel at EP4SGX70DF29C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4SGX110DF29C3G - Stratix IV GX FPGA, 105K LE, 780-FCBGA | Intel
EP4SGX110DF29C3G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4SGX110DF29C3G | EP4SGX70DF29C4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV |
| Logic Elements | 105,600 | — |
| Adaptive Logic Modules (ALMs) | 4,224 LABs | — |
| Total Memory Bits | 9,793,536 | 7,564,880 |
| User I/O Count | 372 | 372 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | 780-BBGA, FCBGA |
| Package Pin/Ball Count | 780 | — |
| Volte ng Pagbibigay | 0.9 V core | — |
| Process Technology | 40 nm | — |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Transceiver Count | [DATA_NEEDED: number of transceivers] | — |
| DSP Blocks | 266 (18x18 multipliers) | — |
| Temperature na Operasyon | Commercial (0C to +85C) - per C3 grade suffix | [DATA_NEEDED: Operating Temperature Range] |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Logic Elements (LE) | — | 72,600 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| Package Code | — | BGA |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Process Node | — | 40 nm |
| Speed Grade | — | C4 (commercial) |