EP4SGX110DF29C3G vs EP4SGX70DF29C4G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX110DF29C3G disebabkan oleh Intel dan EP4SGX70DF29C4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX110DF29C3G | EP4SGX70DF29C4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV |
| Logic Elements | 105,600 | — |
| Adaptive Logic Modules (ALMs) | 4,224 LABs | — |
| Total Memory Bits | 9,793,536 | 7,564,880 |
| User I/O Count | 372 | 372 |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | 780-BBGA, FCBGA |
| Package Pin/Ball Count | 780 | — |
| Tegangan Pemberi Arus | 0.9 V core | — |
| Process Technology | 40 nm | — |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Transceiver Count | [DATA_NEEDED: number of transceivers] | — |
| DSP Blocks | 266 (18x18 multipliers) | — |
| Suhu Operasi | Commercial (0C to +85C) - per C3 grade suffix | [DATA_NEEDED: Operating Temperature Range] |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Jenis Pemasangan | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Logic Elements (LE) | — | 72,600 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| Package Code | — | BGA |
| Package Body Size | — | 29 mm × 29 mm |
| Ball Pitch | — | 1.0 mm |
| Process Node | — | 40 nm |
| Speed Grade | — | C4 (commercial) |