EP4SGX110HF35C3G vs EP4SGX110DF29C3G Perbandingan
Perbandingan bersamaan detil EP4SGX110HF35C3G dari Intel dan EP4SGX110DF29C3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX110HF35C3G | EP4SGX110DF29C3G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | Stratix IV GX |
| Sub-family | GX (transceiver-optimized) | — |
| Logic Elements | 105,600 | 105,600 |
| Embedded Memory Bits | 9,793,536 | — |
| Embedded Memory (Kbits) | 9,564 Kbit (9793536 bits) | — |
| Number of Logic Array Blocks | [DATA_NEEDED: LAB count] | — |
| Number of Registers | [DATA_NEEDED: register count] | — |
| Maximum User I/O | 488 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate | 3.125 Gbps (low-power mode) - 8.5 Gbps | Up to 8.5 Gbps |
| 18x18 Multipliers | [DATA_NEEDED: DSP block count] | — |
| PCIe Hard IP | Yes | — |
| Paket | 1152-BBGA, FCBGA (HF35, 35x35 mm) | — |
| Package Code | HF35 (FineLine BGA, 35mm) | — |
| Speed Grade | C3 (commercial) | — |
| Suhu Kerja | [DATA_NEEDED: junction temperature range] | Commercial (0C to +85C) - per C3 grade suffix |
| Process Technology | 40 nm TSMC | 40 nm |
| Tipe Mounting | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Status RoHS | Compliant (lead-free FBGA) | [DATA_NEEDED: RoHS compliance status] |
| Level MSL | [DATA_NEEDED: MSL rating] | — |
| Adaptive Logic Modules (ALMs) | — | 4,224 LABs |
| Total Memory Bits | — | 9,793,536 |
| User I/O Count | — | 372 |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip) |
| Package Pin/Ball Count | — | 780 |
| Tegangan Pemuat | — | 0.9 V core |
| Transceiver Count | — | [DATA_NEEDED: number of transceivers] |
| DSP Blocks | — | 266 (18x18 multipliers) |