EP4SGX110HF35C3G vs EP4SGX110DF29C3G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX110HF35C3G disebabkan oleh Intel dan EP4SGX110DF29C3G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP4SGX110HF35C3G EP4SGX110DF29C3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Stratix IV GX Stratix IV GX
Family Stratix IV Stratix IV GX
Sub-family GX (transceiver-optimized) —
Logic Elements 105,600 105,600
Embedded Memory Bits 9,793,536 —
Embedded Memory (Kbits) 9,564 Kbit (9793536 bits) —
Number of Logic Array Blocks [DATA_NEEDED: LAB count] —
Number of Registers [DATA_NEEDED: register count] —
Maximum User I/O 488 —
Transceiver Channels 8 (up to 8.5 Gbps) —
Number of Transceivers 8 —
Transceiver Data Rate 3.125 Gbps (low-power mode) - 8.5 Gbps Up to 8.5 Gbps
18x18 Multipliers [DATA_NEEDED: DSP block count] —
PCIe Hard IP Yes —
Kemasan 1152-BBGA, FCBGA (HF35, 35x35 mm) —
Package Code HF35 (FineLine BGA, 35mm) —
Speed Grade C3 (commercial) —
Suhu Operasi [DATA_NEEDED: junction temperature range] Commercial (0C to +85C) - per C3 grade suffix
Process Technology 40 nm TSMC 40 nm
Jenis Pemasangan Surface Mount Surface Mount (Flip-Chip BGA)
Status RoHS Compliant (lead-free FBGA) [DATA_NEEDED: RoHS compliance status]
Aras MSL [DATA_NEEDED: MSL rating] —
Adaptive Logic Modules (ALMs) — 4,224 LABs
Total Memory Bits — 9,793,536
User I/O Count — 372
Package Type — 780-BBGA, FCBGA (Flip-Chip)
Package Pin/Ball Count — 780
Tegangan Pemberi Arus — 0.9 V core
Transceiver Count — [DATA_NEEDED: number of transceivers]
DSP Blocks — 266 (18x18 multipliers)

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