EP4SGX110HF35C3G vs EP4SGX110DF29C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX110HF35C3G sa pamamagitan ng Intel at EP4SGX110DF29C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4SGX110HF35C3G EP4SGX110DF29C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Stratix IV GX Stratix IV GX
Family Stratix IV Stratix IV GX
Sub-family GX (transceiver-optimized) —
Logic Elements 105,600 105,600
Embedded Memory Bits 9,793,536 —
Embedded Memory (Kbits) 9,564 Kbit (9793536 bits) —
Number of Logic Array Blocks [DATA_NEEDED: LAB count] —
Number of Registers [DATA_NEEDED: register count] —
Maximum User I/O 488 —
Transceiver Channels 8 (up to 8.5 Gbps) —
Number of Transceivers 8 —
Transceiver Data Rate 3.125 Gbps (low-power mode) - 8.5 Gbps Up to 8.5 Gbps
18x18 Multipliers [DATA_NEEDED: DSP block count] —
PCIe Hard IP Yes —
Packhaging 1152-BBGA, FCBGA (HF35, 35x35 mm) —
Package Code HF35 (FineLine BGA, 35mm) —
Speed Grade C3 (commercial) —
Temperature na Operasyon [DATA_NEEDED: junction temperature range] Commercial (0C to +85C) - per C3 grade suffix
Process Technology 40 nm TSMC 40 nm
Uri ng Pagpapasok Surface Mount Surface Mount (Flip-Chip BGA)
Tindminan RoHS Compliant (lead-free FBGA) [DATA_NEEDED: RoHS compliance status]
Level ng MSL [DATA_NEEDED: MSL rating] —
Adaptive Logic Modules (ALMs) — 4,224 LABs
Total Memory Bits — 9,793,536
User I/O Count — 372
Package Type — 780-BBGA, FCBGA (Flip-Chip)
Package Pin/Ball Count — 780
Volte ng Pagbibigay — 0.9 V core
Transceiver Count — [DATA_NEEDED: number of transceivers]
DSP Blocks — 266 (18x18 multipliers)

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