EP4SGX70DF29I3G vs EP4SGX70DF29C2XG Perbandingan

Perbandingan bersamaan detil EP4SGX70DF29I3G dari Intel dan EP4SGX70DF29C2XG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP4SGX70DF29I3G EP4SGX70DF29C2XG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Stratix IV GX —
Process Technology 40 nm 40 nm
Logic Elements (LE) 72,600 72,600
Embedded Memory Bits 7,564,880 (about 7.5 Mbit) —
Embedded Memory Blocks 72600 —
Number of Logic Cells / Arrays 372 —
Number of User I/O Pins 372 —
Number of Transceiver Channels [DATA_NEEDED: exact channel count for this device] —
Transceiver Data Rate [DATA_NEEDED: per-channel data rate] —
Package Type 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) —
Package Code DF29 —
Operating Temperature Grade Industrial (I3) —
Junction Temperature Range -40C to +100C —
Core Supply Voltage 0.87 V to 0.93 V —
Speed Grade -3 —
Tipe Mounting Surface Mount (BGA) Surface Mount
Level MSL [DATA_NEEDED: MSL rating] 3 (168 hours)
Status RoHS Compliant Compliant
Bebas Halogen [DATA_NEEDED: halogen-free claim] —
Family — Stratix IV GX
Embedded Memory — 7,564,880 bits
Maximum User I/O — 372
Core Voltage — 0.9 V
Paket — 780-FBGA (29x29 mm)
Transceiver Speed — Up to 8.5 Gbps
Transceiver Count — [DATA_NEEDED: number of transceiver channels]
DSP Blocks (18x18 Multipliers) — 364
Rentang Suhu Kerja — -40C to +85C (commercial)
Lead-Free — Yes
Tray Packaging — Yes

Spek dan Sumber

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