EP4SGX70DF29I3G vs EP4SGX70DF29C2XG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX70DF29I3G disebabkan oleh Intel dan EP4SGX70DF29C2XG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX70DF29I3G | EP4SGX70DF29C2XG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Stratix IV GX | — |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 72,600 | 72,600 |
| Embedded Memory Bits | 7,564,880 (about 7.5 Mbit) | — |
| Embedded Memory Blocks | 72600 | — |
| Number of Logic Cells / Arrays | 372 | — |
| Number of User I/O Pins | 372 | — |
| Number of Transceiver Channels | [DATA_NEEDED: exact channel count for this device] | — |
| Transceiver Data Rate | [DATA_NEEDED: per-channel data rate] | — |
| Package Type | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) | — |
| Package Code | DF29 | — |
| Operating Temperature Grade | Industrial (I3) | — |
| Junction Temperature Range | -40C to +100C | — |
| Core Supply Voltage | 0.87 V to 0.93 V | — |
| Speed Grade | -3 | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Aras MSL | [DATA_NEEDED: MSL rating] | 3 (168 hours) |
| Status RoHS | Compliant | Compliant |
| Boson Bebas | [DATA_NEEDED: halogen-free claim] | — |
| Family | — | Stratix IV GX |
| Embedded Memory | — | 7,564,880 bits |
| Maximum User I/O | — | 372 |
| Core Voltage | — | 0.9 V |
| Kemasan | — | 780-FBGA (29x29 mm) |
| Transceiver Speed | — | Up to 8.5 Gbps |
| Transceiver Count | — | [DATA_NEEDED: number of transceiver channels] |
| DSP Blocks (18x18 Multipliers) | — | 364 |
| Gambaran Suhu Operasi | — | -40C to +85C (commercial) |
| Lead-Free | — | Yes |
| Tray Packaging | — | Yes |