EPM2210F256C3N vs EPM2210F256C4 Perbandingan
Perbandingan bersamaan detil EPM2210F256C3N dari Intel dan EPM2210F256C4 dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM2210F256C3N | EPM2210F256C4 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Programmable Type | In System Programmable (JTAG, IEEE 1149.1) | — |
| Macrocells | 1700 | — |
| Logic Elements / Blocks | 2210 | — |
| Number of User I/Os | 204 | — |
| Maximum Propagation Delay (tPD) | 7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| Internal Supply Voltage | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) | — |
| I/O Standard Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) | — |
| User Flash Memory | 8 Kbits | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Suhu Hubung Kerja | 0 C to 85 C (commercial, TJ suffix 'C') | — |
| Paket | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA (FBGA) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Process Technology | 0.18 um flash CMOS | 0.18 µm 6-layer-metal flash |
| Status RoHS | Compliant (per DigiKey product page) | Compliant |
| Level MSL | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Logic Elements | — | 2,210 |
| Equivalent Macrocells | — | 1,700 |
| User Flash Memory (UFM) | — | 8 Kbits |
| User I/O Pins | — | 212 |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Pin-to-pin Delay (tPD1) | — | 7 ns |
| Maximum Frequency (fMAX) | — | 201 MHz |
| Suhu Kerja | — | 0 °C to +85 °C (commercial extended) |
| Programming Interface | — | JTAG (IEEE 1149.1) ISP |