EPM2210F256C3N vs EPM2210F256C4 Karşılaştırma
Ayrıntılı yan yana karşılaştırma EPM2210F256C3N tarafından Intel ve EPM2210F256C4 tarafından AlteraAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EPM2210F256C3N | EPM2210F256C4 |
|---|---|---|
| Marka | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Series | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Programmable Type | In System Programmable (JTAG, IEEE 1149.1) | — |
| Macrocells | 1700 | — |
| Logic Elements / Blocks | 2210 | — |
| Number of User I/Os | 204 | — |
| Maximum Propagation Delay (tPD) | 7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| Internal Supply Voltage | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) | — |
| I/O Standard Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) | — |
| User Flash Memory | 8 Kbits | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| İşletim Jant Sıcaklığı | 0 C to 85 C (commercial, TJ suffix 'C') | — |
| Paket | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA (FBGA) |
| Montaj Türü | Surface Mount | Surface Mount |
| Process Technology | 0.18 um flash CMOS | 0.18 µm 6-layer-metal flash |
| RoHS Durumu | Compliant (per DigiKey product page) | Compliant |
| MSL Seviyesi | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Logic Elements | — | 2,210 |
| Equivalent Macrocells | — | 1,700 |
| User Flash Memory (UFM) | — | 8 Kbits |
| User I/O Pins | — | 212 |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Pin-to-pin Delay (tPD1) | — | 7 ns |
| Maximum Frequency (fMAX) | — | 201 MHz |
| İşletim Sıcaklığı | — | 0 °C to +85 °C (commercial extended) |
| Programming Interface | — | JTAG (IEEE 1149.1) ISP |