EPM2210F256C3N vs EPM2210F256C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM2210F256C3N disebabkan oleh Intel dan EPM2210F256C4 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM2210F256C3N | EPM2210F256C4 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Programmable Type | In System Programmable (JTAG, IEEE 1149.1) | — |
| Macrocells | 1700 | — |
| Logic Elements / Blocks | 2210 | — |
| Number of User I/Os | 204 | — |
| Maximum Propagation Delay (tPD) | 7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| Internal Supply Voltage | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) | — |
| I/O Standard Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) | — |
| User Flash Memory | 8 Kbits | — |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Suhu Hubungan Operasi | 0 C to 85 C (commercial, TJ suffix 'C') | — |
| Kemasan | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA (FBGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Process Technology | 0.18 um flash CMOS | 0.18 µm 6-layer-metal flash |
| Status RoHS | Compliant (per DigiKey product page) | Compliant |
| Aras MSL | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Logic Elements | — | 2,210 |
| Equivalent Macrocells | — | 1,700 |
| User Flash Memory (UFM) | — | 8 Kbits |
| User I/O Pins | — | 212 |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Pin-to-pin Delay (tPD1) | — | 7 ns |
| Maximum Frequency (fMAX) | — | 201 MHz |
| Suhu Operasi | — | 0 °C to +85 °C (commercial extended) |
| Programming Interface | — | JTAG (IEEE 1149.1) ISP |