EPM570F256C4N vs EPM2210F256C5N Perbandingan
Perbandingan bersamaan detil EPM570F256C4N dari Intel dan EPM2210F256C5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM570F256C4N | EPM2210F256C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | — |
| Logic Elements | 570 LE | 2210 |
| Macrocells | 440 | 1700 |
| Logic Array Blocks (LABs) | 57 | — |
| User I/O Count | 160 | — |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbits |
| Paket | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (17x17mm, 1mm pitch) |
| Package Size | 17 mm × 17 mm | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 um CMOS with on-chip flash |
| Maximum Internal Frequency | 304 MHz | 201.1 MHz |
| Pin-to-Pin Logic Delay | 5.4 ns | — |
| Operating Supply Voltage (VCCINT) | 2.5 V, 3.3 V | — |
| MultiVolt I/O Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Rentang Suhu Kerja | 0 °C to +70 °C (commercial) | — |
| In-System Programmability (ISP) | Yes (JTAG) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Family | — | MAX II |
| User I/Os | — | 204 |
| Propagation Delay (tPD) | — | 7 ns |
| Turn-On Delay (tSU) | — | 11.2 ns |
| Supply Voltage (VCCINT) | — | 2.375 V to 3.6 V (3.3 V typical) |
| I/O Voltage Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Global Clocks | — | 4 |
| Suhu Kerja | — | 0C to +85C (commercial) |
| Configuration Memory | — | Internal flash (non-volatile, instant-on) |
| Programming Interface | — | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster |
| Lead-Free | — | Yes |