EPM570F256C4N vs EPM2210F256C5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570F256C4N disebabkan oleh Intel dan EPM2210F256C5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570F256C4N | EPM2210F256C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | — |
| Logic Elements | 570 LE | 2210 |
| Macrocells | 440 | 1700 |
| Logic Array Blocks (LABs) | 57 | — |
| User I/O Count | 160 | — |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbits |
| Kemasan | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (17x17mm, 1mm pitch) |
| Package Size | 17 mm × 17 mm | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 um CMOS with on-chip flash |
| Maximum Internal Frequency | 304 MHz | 201.1 MHz |
| Pin-to-Pin Logic Delay | 5.4 ns | — |
| Operating Supply Voltage (VCCINT) | 2.5 V, 3.3 V | — |
| MultiVolt I/O Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Gambaran Suhu Operasi | 0 °C to +70 °C (commercial) | — |
| In-System Programmability (ISP) | Yes (JTAG) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Family | — | MAX II |
| User I/Os | — | 204 |
| Propagation Delay (tPD) | — | 7 ns |
| Turn-On Delay (tSU) | — | 11.2 ns |
| Supply Voltage (VCCINT) | — | 2.375 V to 3.6 V (3.3 V typical) |
| I/O Voltage Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Global Clocks | — | 4 |
| Suhu Operasi | — | 0C to +85C (commercial) |
| Configuration Memory | — | Internal flash (non-volatile, instant-on) |
| Programming Interface | — | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster |
| Lead-Free | — | Yes |