EPM570F256C4N vs EPM570GF256C3 Perbandingan
Perbandingan bersamaan detil EPM570F256C4N dari Intel dan EPM570GF256C3 dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM570F256C4N | EPM570GF256C3 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | — |
| Logic Elements | 570 LE | — |
| Macrocells | 440 | — |
| Logic Array Blocks (LABs) | 57 | — |
| User I/O Count | 160 | — |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit |
| Paket | 256-ball FineLine BGA (FBGA) | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free |
| Package Size | 17 mm × 17 mm | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 um 6-layer-metal flash |
| Maximum Internal Frequency | 304 MHz | — |
| Pin-to-Pin Logic Delay | 5.4 ns | — |
| Operating Supply Voltage (VCCINT) | 2.5 V, 3.3 V | — |
| MultiVolt I/O Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Rentang Suhu Kerja | 0 °C to +70 °C (commercial) | — |
| In-System Programmability (ISP) | Yes (JTAG) | — |
| Tipe Mounting | Surface Mount | — |
| Status RoHS | Compliant | Compliant (lead-free) |
| Family | — | MAX II |
| Device Model | — | EPM570 |
| Logic Elements (LE) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User I/Os (max, FBGA-256) | — | 212 |
| Propagation Delay tPD1 | — | 8.7 ns (C3 speed grade) |
| Internal Performance fMAX | — | 300 MHz |
| Supply Voltage VCCINT | — | 1.8 V (core, MultiVolt) |
| I/O Bank Voltage VCCIO | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Operating Temperature (commercial) | — | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) |
| Programming Interface | — | JTAG (IEEE 1149.1) / ISP |
| Level MSL | — | 3 (per JEDEC J-STD-020, typical for FBGA) |
| Vertical Migration Within FBGA-256 | — | Supported across EPM570 / EPM1270 / EPM2210 |