EPM570F256C4N vs EPM570GF256C3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570F256C4N disebabkan oleh Intel dan EPM570GF256C3 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPM570F256C4N EPM570GF256C3
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series MAX II —
Logic Elements 570 LE —
Macrocells 440 —
Logic Array Blocks (LABs) 57 —
User I/O Count 160 —
User Flash Memory (UFM) 8 Kbit 8 Kbit
Kemasan 256-ball FineLine BGA (FBGA) FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free
Package Size 17 mm × 17 mm —
Process Technology 0.18 µm 6-layer-metal flash 0.18 um 6-layer-metal flash
Maximum Internal Frequency 304 MHz —
Pin-to-Pin Logic Delay 5.4 ns —
Operating Supply Voltage (VCCINT) 2.5 V, 3.3 V —
MultiVolt I/O Voltages 1.5 V, 1.8 V, 2.5 V, 3.3 V —
Gambaran Suhu Operasi 0 °C to +70 °C (commercial) —
In-System Programmability (ISP) Yes (JTAG) —
Jenis Pemasangan Surface Mount —
Status RoHS Compliant Compliant (lead-free)
Family — MAX II
Device Model — EPM570
Logic Elements (LE) — 570
Equivalent Macrocells — 440
User I/Os (max, FBGA-256) — 212
Propagation Delay tPD1 — 8.7 ns (C3 speed grade)
Internal Performance fMAX — 300 MHz
Supply Voltage VCCINT — 1.8 V (core, MultiVolt)
I/O Bank Voltage VCCIO — 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Operating Temperature (commercial) — -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C)
Programming Interface — JTAG (IEEE 1149.1) / ISP
Aras MSL — 3 (per JEDEC J-STD-020, typical for FBGA)
Vertical Migration Within FBGA-256 — Supported across EPM570 / EPM1270 / EPM2210

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