EPM570F256C4N vs EPM570GF256C3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPM570F256C4N sa pamamagitan ng Intel at EPM570GF256C3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPM570F256C4N EPM570GF256C3
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series MAX II —
Logic Elements 570 LE —
Macrocells 440 —
Logic Array Blocks (LABs) 57 —
User I/O Count 160 —
User Flash Memory (UFM) 8 Kbit 8 Kbit
Packhaging 256-ball FineLine BGA (FBGA) FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free
Package Size 17 mm × 17 mm —
Process Technology 0.18 µm 6-layer-metal flash 0.18 um 6-layer-metal flash
Maximum Internal Frequency 304 MHz —
Pin-to-Pin Logic Delay 5.4 ns —
Operating Supply Voltage (VCCINT) 2.5 V, 3.3 V —
MultiVolt I/O Voltages 1.5 V, 1.8 V, 2.5 V, 3.3 V —
Hanay ng Temperature na Operasyon 0 °C to +70 °C (commercial) —
In-System Programmability (ISP) Yes (JTAG) —
Uri ng Pagpapasok Surface Mount —
Tindminan RoHS Compliant Compliant (lead-free)
Family — MAX II
Device Model — EPM570
Logic Elements (LE) — 570
Equivalent Macrocells — 440
User I/Os (max, FBGA-256) — 212
Propagation Delay tPD1 — 8.7 ns (C3 speed grade)
Internal Performance fMAX — 300 MHz
Supply Voltage VCCINT — 1.8 V (core, MultiVolt)
I/O Bank Voltage VCCIO — 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Operating Temperature (commercial) — -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C)
Programming Interface — JTAG (IEEE 1149.1) / ISP
Level ng MSL — 3 (per JEDEC J-STD-020, typical for FBGA)
Vertical Migration Within FBGA-256 — Supported across EPM570 / EPM1270 / EPM2210

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