EPM570GF256C4 vs EPM570GF256C3 Perbandingan
Perbandingan bersamaan detil EPM570GF256C4 dari Intel dan EPM570GF256C3 dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM570GF256C4 | EPM570GF256C3 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | — |
| Macrocells | 440 | — |
| Maximum User I/Os | 212 | — |
| Pin-to-Pin Delay (tPD) | 5.4 ns | — |
| Supply Voltage VCCINT | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) | 1.8 V (core, MultiVolt) |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Suhu Kerja | 0 °C to +85 °C (commercial) | — |
| Paket | 256-ball FBGA (FineLine BGA) | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free |
| Ball Pitch | 1.0 mm | — |
| Tipe Mounting | Surface Mount | — |
| Process Technology | 0.18 µm CMOS, flash-based configuration | 0.18 um 6-layer-metal flash |
| JTAG Support | IEEE 1149.1 boundary-scan + ISP | — |
| Configuration Memory | Non-volatile flash (instant-on, no boot PROM) | — |
| Status RoHS | Lead-free, RoHS compliant | Compliant (lead-free) |
| Device Model | — | EPM570 |
| Logic Elements (LE) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User I/Os (max, FBGA-256) | — | 212 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Propagation Delay tPD1 | — | 8.7 ns (C3 speed grade) |
| Internal Performance fMAX | — | 300 MHz |
| Operating Temperature (commercial) | — | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) |
| Programming Interface | — | JTAG (IEEE 1149.1) / ISP |
| Level MSL | — | 3 (per JEDEC J-STD-020, typical for FBGA) |
| Vertical Migration Within FBGA-256 | — | Supported across EPM570 / EPM1270 / EPM2210 |