EPM570GF256C4 vs EPM570GF256C3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPM570GF256C4 sa pamamagitan ng Intel at EPM570GF256C3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPM570GF256C4 EPM570GF256C3
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family MAX II MAX II
Logic Elements (LEs) 570 —
Macrocells 440 —
Maximum User I/Os 212 —
Pin-to-Pin Delay (tPD) 5.4 ns —
Supply Voltage VCCINT 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) 1.8 V (core, MultiVolt)
I/O Bank Voltage VCCIO 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Temperature na Operasyon 0 °C to +85 °C (commercial) —
Packhaging 256-ball FBGA (FineLine BGA) FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free
Ball Pitch 1.0 mm —
Uri ng Pagpapasok Surface Mount —
Process Technology 0.18 µm CMOS, flash-based configuration 0.18 um 6-layer-metal flash
JTAG Support IEEE 1149.1 boundary-scan + ISP —
Configuration Memory Non-volatile flash (instant-on, no boot PROM) —
Tindminan RoHS Lead-free, RoHS compliant Compliant (lead-free)
Device Model — EPM570
Logic Elements (LE) — 570
Equivalent Macrocells — 440
User I/Os (max, FBGA-256) — 212
User Flash Memory (UFM) — 8 Kbit
Propagation Delay tPD1 — 8.7 ns (C3 speed grade)
Internal Performance fMAX — 300 MHz
Operating Temperature (commercial) — -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C)
Programming Interface — JTAG (IEEE 1149.1) / ISP
Level ng MSL — 3 (per JEDEC J-STD-020, typical for FBGA)
Vertical Migration Within FBGA-256 — Supported across EPM570 / EPM1270 / EPM2210

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