EPM570GF256C4 vs EPM570GF256C3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570GF256C4 disebabkan oleh Intel dan EPM570GF256C3 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570GF256C4 | EPM570GF256C3 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | — |
| Macrocells | 440 | — |
| Maximum User I/Os | 212 | — |
| Pin-to-Pin Delay (tPD) | 5.4 ns | — |
| Supply Voltage VCCINT | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) | 1.8 V (core, MultiVolt) |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Suhu Operasi | 0 °C to +85 °C (commercial) | — |
| Kemasan | 256-ball FBGA (FineLine BGA) | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free |
| Ball Pitch | 1.0 mm | — |
| Jenis Pemasangan | Surface Mount | — |
| Process Technology | 0.18 µm CMOS, flash-based configuration | 0.18 um 6-layer-metal flash |
| JTAG Support | IEEE 1149.1 boundary-scan + ISP | — |
| Configuration Memory | Non-volatile flash (instant-on, no boot PROM) | — |
| Status RoHS | Lead-free, RoHS compliant | Compliant (lead-free) |
| Device Model | — | EPM570 |
| Logic Elements (LE) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User I/Os (max, FBGA-256) | — | 212 |
| User Flash Memory (UFM) | — | 8 Kbit |
| Propagation Delay tPD1 | — | 8.7 ns (C3 speed grade) |
| Internal Performance fMAX | — | 300 MHz |
| Operating Temperature (commercial) | — | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) |
| Programming Interface | — | JTAG (IEEE 1149.1) / ISP |
| Aras MSL | — | 3 (per JEDEC J-STD-020, typical for FBGA) |
| Vertical Migration Within FBGA-256 | — | Supported across EPM570 / EPM1270 / EPM2210 |