IS43TR16256AL-125KBLI-TR vs MT41K128M16JT Perbandingan
Perbandingan bersamaan detil IS43TR16256AL-125KBLI-TR dari ISSI, Integrated Silicon Solution Inc dan MT41K128M16JT dari Micron Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
ISSI, Integrated Silicon Solution Inc
IS43TR16256AL-125KBLI-TR - 4Gbit DDR3L SDRAM 256Mx16 | ISSI
IS43TR16256AL-125KBLI-TR ✓ Aktif
Perbandingan Spesifikasi
| Parameter Umum | IS43TR16256AL-125KBLI-TR | MT41K128M16JT |
|---|---|---|
| Merek | ISSI, Integrated Silicon Solution Inc | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Harga Unit (USD) | $8,25 | — |
| Tipe Memori | DDR3L SDRAM | DDR3L SDRAM |
| Ukuran Memori | 4Gbit (256M x 16) | — |
| Lebar Bus Data | 16 bit | — |
| Clock Frequency | 800 MHz | — |
| Laju Data | 1600 Mbps | — |
| Latensi CAS | 11 | — |
| Supply Voltage (VDD/VDDQ) | 1.35V ± 0.1V, -0.067V | 1.35 V (typ) / 1.283 V to 1.45 V (DDR3L) |
| Backward Compatible Voltage | 1.5V | — |
| Row Cycle Time (tRC) | 20 ns | — |
| Row Active Time (tRAS) | 20 ns | — |
| Rentang Suhu Kerja | -40°C to +95°C (TC) | — |
| Paket | 96-TWBGA (9x13 mm) | 96-FBGA (8 mm x 14 mm, 0.8 mm pitch) |
| Tipe Mounting | Surface Mount | Surface Mount (FBGA) |
| Burst Length | 8 | — |
| On-Die Termination (ODT) | Yes | — |
| Refresh Modes | Auto-refresh, Self-refresh | — |
| Status RoHS | Compliant | Compliant (Pb-free FBGA) |
| Density | — | 2 Gbit |
| Organisasi | — | 128M x 16 |
| Banks | — | 8 banks |
| Prefetch Architecture | — | 8n-bit prefetch |
| Access Time | — | 0.225 ns (CK to DQ, -125 bin) |
| Cycle Time | — | 1.25 ns (-125 bin) / 1.07 ns (-107 bin) |
| Max Data Rate | — | 1600 MT/s (-125) / 1866 MT/s (-107) |
| Suhu Kerja | — | 0C to +95C (commercial, no suffix) |
| Industrial Temperature Option | — | -40C to +95C (IT suffix) |
| Automotive Temperature Option | — | -40C to +105C (AAT) / -40C to +95C (AIT) |
| Process Technology | — | CMOS |
| On-Die Termination | — | Dynamic ODT (nominal/weak/strong) |
| Calibration | — | ZQ calibration (240 ohm ext. resistor) |
| Refresh | — | Auto self-refresh (ASR) |
| Write Feature | — | Write leveling + data mask |