K4A4G165WF-BCRC vs K4A4G165WD-BCRC Perbandingan
Perbandingan bersamaan detil K4A4G165WF-BCRC dari Samsung Electronics dan K4A4G165WD-BCRC dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Samsung Electronics
K4A4G165WF-BCRC - 4Gb DDR4-2400 SDRAM | Samsung Electronics
K4A4G165WF-BCRC ✓ Aktif
Perbandingan Spesifikasi
| Parameter Umum | K4A4G165WF-BCRC | K4A4G165WD-BCRC |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | DRAM | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Harga Unit (USD) | $17,08 | — |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | 4 Gbit |
| Organisasi | 256M x 16 | 256M x 16 |
| Speed Grade | DDR4-2400 | — |
| Tegangan Pemuat | 1.2 V | 1.2 V |
| Operating Voltage Range | 1.14 V to 1.26 V | — |
| Paket | FBGA-96 (TFBGA) | FBGA-96 |
| Die Type | Samsung 4Gb F-die | — |
| Bank / Bank Group Architecture | 8 banks, bank groups | — |
| Data Mask | Supported (DM) | — |
| CRC / CA Parity | Supported | — |
| ZQ Calibration | Supported | Yes |
| Dynamic ODT | Supported | — |
| Auto Precharge | Supported | Yes |
| Asynchronous Reset | Supported | — |
| Suhu Kerja | 0C to +95C | [DATA_NEEDED: operating temperature range] |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Lead free / RoHS Compliant |
| Speed Bin | — | DDR4-2400 (BCRC) |
| Process Generation | — | Samsung D-die |
| Tipe Antarmuka | — | DDR4 (double data rate, parallel) |
| On-Die Termination (ODT) | — | Yes |
| Data Mask Function | — | Yes |
| CRC Function | — | Yes |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |