K4A4G165WF-BCRC vs K4A4G165WD-BCRC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4A4G165WF-BCRC sa pamamagitan ng Samsung Electronics at K4A4G165WD-BCRC sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K4A4G165WF-BCRC - 4Gb DDR4-2400 SDRAM | Samsung Electronics
K4A4G165WF-BCRC ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | K4A4G165WF-BCRC | K4A4G165WD-BCRC |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | DRAM | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Presyo ng Yunit (USD) | $17.08 | — |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | 4 Gbit |
| Organisasyon | 256M x 16 | 256M x 16 |
| Speed Grade | DDR4-2400 | — |
| Volte ng Pagbibigay | 1.2 V | 1.2 V |
| Operating Voltage Range | 1.14 V to 1.26 V | — |
| Packhaging | FBGA-96 (TFBGA) | FBGA-96 |
| Die Type | Samsung 4Gb F-die | — |
| Bank / Bank Group Architecture | 8 banks, bank groups | — |
| Data Mask | Supported (DM) | — |
| CRC / CA Parity | Supported | — |
| ZQ Calibration | Supported | Yes |
| Dynamic ODT | Supported | — |
| Auto Precharge | Supported | Yes |
| Asynchronous Reset | Supported | — |
| Temperature na Operasyon | 0C to +95C | [DATA_NEEDED: operating temperature range] |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Lead free / RoHS Compliant |
| Speed Bin | — | DDR4-2400 (BCRC) |
| Process Generation | — | Samsung D-die |
| Uri ng Interface | — | DDR4 (double data rate, parallel) |
| On-Die Termination (ODT) | — | Yes |
| Data Mask Function | — | Yes |
| CRC Function | — | Yes |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |