K4A4G165WF-BCRC vs K4A4G165WD-BCRC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4A4G165WF-BCRC disebabkan oleh Samsung Electronics dan K4A4G165WD-BCRC disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4A4G165WF-BCRC - 4Gb DDR4-2400 SDRAM | Samsung Electronics
K4A4G165WF-BCRC ✓ Aktif
Pengandingan Spesifikasi
| Parametr | K4A4G165WF-BCRC | K4A4G165WD-BCRC |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | DRAM | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Harga Unit (USD) | $17.08 | — |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | 4 Gbit |
| Organisasi | 256M x 16 | 256M x 16 |
| Speed Grade | DDR4-2400 | — |
| Tegangan Pemberi Arus | 1.2 V | 1.2 V |
| Operating Voltage Range | 1.14 V to 1.26 V | — |
| Kemasan | FBGA-96 (TFBGA) | FBGA-96 |
| Die Type | Samsung 4Gb F-die | — |
| Bank / Bank Group Architecture | 8 banks, bank groups | — |
| Data Mask | Supported (DM) | — |
| CRC / CA Parity | Supported | — |
| ZQ Calibration | Supported | Yes |
| Dynamic ODT | Supported | — |
| Auto Precharge | Supported | Yes |
| Asynchronous Reset | Supported | — |
| Suhu Operasi | 0C to +95C | [DATA_NEEDED: operating temperature range] |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Lead free / RoHS Compliant |
| Speed Bin | — | DDR4-2400 (BCRC) |
| Process Generation | — | Samsung D-die |
| Jenis Antaramuka | — | DDR4 (double data rate, parallel) |
| On-Die Termination (ODT) | — | Yes |
| Data Mask Function | — | Yes |
| CRC Function | — | Yes |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |