K4AAG165WA-BCWE vs K4AAG165WA-BCTD Perbandingan
Perbandingan bersamaan detil K4AAG165WA-BCWE dari Samsung Electronics dan K4AAG165WA-BCTD dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4AAG165WA-BCWE | K4AAG165WA-BCTD |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Ukuran Memori | 16 Gb (2 GB) | 16 Gb |
| Memory Organization | 1G x 16 | 1G x 16 |
| Laju Data | 3200 Mbps (DDR4-3200) | 2666 Mbps |
| Tegangan Pemuat | 1.2 V | 1.2 V |
| Paket | 96-ball FBGA | 96-FBGA |
| Package Dimensions | 13 x 9 mm | — |
| Ball Pitch | 0.8 mm | — |
| Suhu Kerja | -40C to +95C | 0C to +85C |
| Tipe Antarmuka | Parallel, DDR4 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Memory Format | DRAM (Volatile) | Volatile (DRAM) |
| Technology | DDR4 SDRAM, 8n prefetch, bank group architecture | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | — |
| Product Status | Active | — |
| Antarmuka | — | Synchronous, DDR4 |
| Bank Architecture | — | DDR4 bank-group architecture |
| Technology Family | — | DDR4 SDRAM (Samsung K4AAG165WA series) |
| Application Class | — | Computing, embedded, consumer main memory |
| Package Family | — | FBGA -> fine-pitch BGA -> surface mount |
| Temperature Grade | — | Commercial (0C to +85C) |
| Level MSL | — | [DATA_NEEDED: moisture sensitivity level] |