K4AAG165WA-BCWE vs K4AAG165WA-BCTD Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4AAG165WA-BCWE disebabkan oleh Samsung Electronics dan K4AAG165WA-BCTD disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K4AAG165WA-BCWE | K4AAG165WA-BCTD |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Saiz Ingatan | 16 Gb (2 GB) | 16 Gb |
| Memory Organization | 1G x 16 | 1G x 16 |
| Kadar Data | 3200 Mbps (DDR4-3200) | 2666 Mbps |
| Tegangan Pemberi Arus | 1.2 V | 1.2 V |
| Kemasan | 96-ball FBGA | 96-FBGA |
| Package Dimensions | 13 x 9 mm | — |
| Ball Pitch | 0.8 mm | — |
| Suhu Operasi | -40C to +95C | 0C to +85C |
| Jenis Antaramuka | Parallel, DDR4 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Memory Format | DRAM (Volatile) | Volatile (DRAM) |
| Technology | DDR4 SDRAM, 8n prefetch, bank group architecture | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | — |
| Product Status | Active | — |
| Antaramuka | — | Synchronous, DDR4 |
| Bank Architecture | — | DDR4 bank-group architecture |
| Technology Family | — | DDR4 SDRAM (Samsung K4AAG165WA series) |
| Application Class | — | Computing, embedded, consumer main memory |
| Package Family | — | FBGA -> fine-pitch BGA -> surface mount |
| Temperature Grade | — | Commercial (0C to +85C) |
| Aras MSL | — | [DATA_NEEDED: moisture sensitivity level] |