K4RHE086VB-BCWM vs K4RHE086VP Perbandingan
Perbandingan bersamaan detil K4RHE086VB-BCWM dari Samsung Electronics dan K4RHE086VP dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4RHE086VB-BCWM | K4RHE086VP |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | DDR5 |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR5 SDRAM | DDR5 SDRAM |
| Density | 24 Gb | 24 Gb |
| Organisasi | 2G x 8 | x8 |
| Laju Data | 5600 Mbps | — |
| Tegangan Pemuat | 1.1 V | — |
| Paket | 82 FBGA | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Antarmuka | DDR5 (JEDEC) | — |
| Configuration | x8 | — |
| Application Segment | Server / Data Center / Premium PC | — |
| Manufacturer | Samsung Semiconductor | — |
| Status RoHS | unknown | [DATA_NEEDED: RoHS status] |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Access Time / CAS Latency | [DATA_NEEDED: CAS latency] | — |
| On-Die ECC | [DATA_NEEDED: on-die ECC support] | Yes (DDR5 standard feature) |
| Package Height | [DATA_NEEDED: package height] | — |
| Process Node | — | 1a-class (D1a) |
| Package Type | — | FBGA |
| Tipe Antarmuka | — | DDR5 (double data rate 5) |
| Maximum Data Rate | — | [DATA_NEEDED: speed bin data rate] |
| Supply Voltage (VDD) | — | [DATA_NEEDED: VDD in V] |
| Bank Groups | — | [DATA_NEEDED: bank group count] |
| Rentang Suhu Kerja | — | [DATA_NEEDED: temperature range] |
| Merek | — | Samsung Electronics |
| Product Family | — | Samsung K4RHE DDR5 series |
| Typical Application | — | Server / client DRAM modules |