M29W800FT70ZA3SF vs M29W800FB70ZA3SE Perbandingan
Perbandingan bersamaan detil M29W800FT70ZA3SF dari Micron Technology dan M29W800FB70ZA3SE dari Micron Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Micron Technology
M29W800FB70ZA3SE - 8Mbit NOR Flash 70ns 48-TFBGA | Micron
M29W800FB70ZA3SE ObsoletePerbandingan Spesifikasi
| Parameter Umum | M29W800FT70ZA3SF | M29W800FB70ZA3SE |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Tipe Memori | NOR Flash | NOR Flash, Parallel |
| Density | 8 Mbit | — |
| Antarmuka | Parallel | Parallel, address/data bus |
| Access Time | 70 ns | 70 ns |
| Tegangan Pemuat | 2.7 V to 3.6 V | 3 V / 3.3 V (2.7 V to 3.6 V class) |
| Suhu Kerja | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| Paket | 48-TFBGA (6 x 8 mm) | 48-TFBGA (6 x 8 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Boot Block Configuration | Top boot block (FT) | — |
| Memory Organization | [DATA_NEEDED: memory organization x8/x16] | — |
| Program/Erase Cycles | [DATA_NEEDED: endurance cycles] | — |
| Data Retention | [DATA_NEEDED: data retention years] | — |
| Active Read Current | [DATA_NEEDED: active read current] | [DATA_NEEDED: ICC read] |
| Standby Current | [DATA_NEEDED: standby current] | [DATA_NEEDED: ICC standby] |
| Package Body Size | 6 x 8 mm | — |
| Ball Pitch | 0.80 mm | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Ukuran Memori | — | 8 Mbit |
| Organisasi | — | 1 M x 8 / 512 K x 16 |
| Technology | — | SLC NOR |
| Boot Block Architecture | — | Bottom boot block (FB) |
| Qualification | — | AEC-Q100 automotive |
| Packaging | — | Tray |
| Program/Erase Endurance | — | [DATA_NEEDED: endurance cycles] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL] |