MC34903CP5EK vs MC34903CP3EK Perbandingan
Perbandingan bersamaan detil MC34903CP5EK dari NXP Semiconductors dan MC34903CP3EK dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC34903CP5EK - 5V/400mA SBC with HS-CAN, 32-SOIC | NXP
MC34903CP5EK ⚠ Waktu Beli TerakhirNXP Semiconductors
MC34903CP3EK - System Basis Chip PMIC, 32-SOIC-EP | NXP
MC34903CP3EK ✗ Akhir HidupPerbandingan Spesifikasi
| Parameter Umum | MC34903CP5EK | MC34903CP3EK |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Specialized PMIC | Power Management |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Akhir Hidup |
| Product Type | System Basis Chip (SBC) with dual LDO + HS-CAN | — |
| Number of LDOs | 2 | — |
| LDO Output Voltage | 5.0 V (typ) | 3.3 V (x2) |
| LDO Output Current (each) | 400 mA | — |
| Rentang Tegangan Masukan | 5.5 V to 28 V | — |
| Load Dump Tolerance | 40 V (max) | — |
| Quiescent Current (standby) | 2 mA (typ) | — |
| Number of Wake-up Inputs | 3 | — |
| CAN Interface | High-Speed CAN (ISO 11898-2/5), up to 1 Mbaud | 1 Mbps, ISO 11898 compliant |
| Communication Interface | SPI (control/status) | — |
| Rentang Suhu Kerja | -40 °C to +125 °C | — |
| Package Type | SOIC-32 (exposed pad, 7.5 mm body) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | 3 (per JEDEC J-STD-020) | 3 (168 hours) |
| Automotive Qualification | AEC-Q100 qualified | — |
| Status RoHS | Compliant | Compliant |
| Fungsi | — | System Basis Chip (SBC) - PMIC + CAN + LIN |
| Topologi | — | Dual LDO + high-side switches + CAN/LIN transceivers |
| Jumlah Output | — | 2 LDOs + multiple high-side drivers |
| LDO Output Current | — | 400 mA per LDO |
| LIN Interface | — | LIN 2.0 slave |
| Wake-up Inputs | — | 3 (cyclic and edge-triggered) |
| Supply Voltage Range | — | 9 V to 18 V nominal (5.5 V to 40 V transient) |
| Suhu Kerja | — | -40C to +125C |
| Paket | — | 32-SOIC-EP (exposed pad) |
| Configuration Interface | — | SPI / SCI |
| Penutupan Panas | — | Integrated |
| Status Lingkungan Hidup | — | End of Life (per NXP product page) |